No clean solder paste reduces voiding to 1%

AIM V9 low-voiding, no clean solder paste is formulated to reduce voiding to as low as 1% on BGAs and <5% on BTCs components, while exhibiting stable print performance on fine feature devices over 12-hours. Product post-process residue is easily probed and possess high SIR values required for high reliability applications. Both REACH and RoHS compliant, product is available in SAC305 T4. Product reduces solder joint reliability and thermal dissipation concerns, while improving production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on BGA and BTC packages.

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